Offre emploi Packaging Corporation of America

1 offre d'emploi pour Packaging Corporation of America :

Field Apps Engineer - PVD, Etch
and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel... in Europe, North America and Asia-Pacific, and offers comprehensive service and spare parts support through a worldwide network... - Voir cette offre d'emploi
Date de publication : 19 octobre 2025